Glossary:BGA: Revision history

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    27 May 2024

    • curprev 14:2714:27, 27 May 2024Philip talk contribs 426 bytes +426 Created page with "BGA or Ball Grid Array is a type of surface mount integrated circuit package having connections in an array on the entire underside. Tiny balls of solder attach it to an identcal pattern of connections on the circuit board. This allows for a very large number of connections, not limited to the edges of the package. It's commonly used for processor and memory chips."