Glossary:BGA: Difference between revisions
(Created page with "BGA or Ball Grid Array is a type of surface mount integrated circuit package having connections in an array on the entire underside. Tiny balls of solder attach it to an identcal pattern of connections on the circuit board. This allows for a very large number of connections, not limited to the edges of the package. It's commonly used for processor and memory chips.") |
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Latest revision as of 14:27, 27 May 2024
BGA or Ball Grid Array is a type of surface mount integrated circuit package having connections in an array on the entire underside. Tiny balls of solder attach it to an identcal pattern of connections on the circuit board. This allows for a very large number of connections, not limited to the edges of the package. It's commonly used for processor and memory chips.